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Thermal Design, Analysis and Experimental Verification of Electronic Equipment of a Satellite Borne Microwave Radiometer
Chen, Bo; Chen, B (reprint author), Chinese Acad Sci, Natl Space Sci Ctr, Beijing 100190, Peoples R China.
Department微波遥感部
Source PublicationENGINEERING SOLUTIONS FOR MANUFACTURING PROCESSES, PTS 1-3
2013
Volume655-657Pages:84-87
ISSN1662-8985
Language英语
KeywordThermal Simulation Thermal Analysis Cae Derated Maximum Junction Temperature
AbstractThermal design, finite element analysis and experiment verification of electronic equipment of a satellite borne microwave radiometer are introduced. Some methods were adopted to help heat conduct and a finite element model was built. The analysis results show that the temperature scopes of the main structures are from 45℃ to63.9℃ in the digital control equipment and 45℃ to 68.7℃ in the receiver equipment and all of junction temperatures of the components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis. The experimental results show that the computing values are close to experimental values and the largest error is 10.1℃, which is allowed for engineering application.; Thermal design, finite element analysis and experiment verification of electronic equipment of a satellite borne microwave radiometer are introduced. Some methods were adopted to help heat conduct and a finite element model was built. The analysis results show that the temperature scopes of the main structures are from 45 degrees C to63.9 degrees C in the digital control equipment and 45 degrees C to 68.7 degrees C in the receiver equipment and all of junction temperatures of the components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis. The experimental results show that the computing values are close to experimental values and the largest error is 10.1 degrees C, which is allowed for engineering application.
Indexed ByEI ; CPCI
Funding Project中国科学院空间科学与应用研究中心
Document Type期刊论文
Identifierhttp://ir.nssc.ac.cn/handle/122/2055
Collection微波遥感部
Corresponding AuthorChen, B (reprint author), Chinese Acad Sci, Natl Space Sci Ctr, Beijing 100190, Peoples R China.
Recommended Citation
GB/T 7714
Chen, Bo,Chen, B . Thermal Design, Analysis and Experimental Verification of Electronic Equipment of a Satellite Borne Microwave Radiometer[J]. ENGINEERING SOLUTIONS FOR MANUFACTURING PROCESSES, PTS 1-3,2013,655-657:84-87.
APA Chen, Bo,&Chen, B .(2013).Thermal Design, Analysis and Experimental Verification of Electronic Equipment of a Satellite Borne Microwave Radiometer.ENGINEERING SOLUTIONS FOR MANUFACTURING PROCESSES, PTS 1-3,655-657,84-87.
MLA Chen, Bo,et al."Thermal Design, Analysis and Experimental Verification of Electronic Equipment of a Satellite Borne Microwave Radiometer".ENGINEERING SOLUTIONS FOR MANUFACTURING PROCESSES, PTS 1-3 655-657(2013):84-87.
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