Thermal Design, Analysis and Experimental Verification of Electronic Equipment of a Satellite Borne Microwave Radiometer | |
Chen, Bo; Chen, B (reprint author), Chinese Acad Sci, Natl Space Sci Ctr, Beijing 100190, Peoples R China. | |
Department | 微波遥感部 |
Source Publication | ENGINEERING SOLUTIONS FOR MANUFACTURING PROCESSES, PTS 1-3
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2013 | |
Volume | 655-657Pages:84-87 |
ISSN | 1662-8985 |
Language | 英语 |
Keyword | Thermal Simulation Thermal Analysis Cae Derated Maximum Junction Temperature |
Abstract | Thermal design, finite element analysis and experiment verification of electronic equipment of a satellite borne microwave radiometer are introduced. Some methods were adopted to help heat conduct and a finite element model was built. The analysis results show that the temperature scopes of the main structures are from 45℃ to63.9℃ in the digital control equipment and 45℃ to 68.7℃ in the receiver equipment and all of junction temperatures of the components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis. The experimental results show that the computing values are close to experimental values and the largest error is 10.1℃, which is allowed for engineering application.; Thermal design, finite element analysis and experiment verification of electronic equipment of a satellite borne microwave radiometer are introduced. Some methods were adopted to help heat conduct and a finite element model was built. The analysis results show that the temperature scopes of the main structures are from 45 degrees C to63.9 degrees C in the digital control equipment and 45 degrees C to 68.7 degrees C in the receiver equipment and all of junction temperatures of the components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis. The experimental results show that the computing values are close to experimental values and the largest error is 10.1 degrees C, which is allowed for engineering application. |
Indexed By | EI ; CPCI |
Funding Project | 中国科学院空间科学与应用研究中心 |
Document Type | 期刊论文 |
Identifier | http://ir.nssc.ac.cn/handle/122/2055 |
Collection | 微波遥感部 |
Corresponding Author | Chen, B (reprint author), Chinese Acad Sci, Natl Space Sci Ctr, Beijing 100190, Peoples R China. |
Recommended Citation GB/T 7714 | Chen, Bo,Chen, B . Thermal Design, Analysis and Experimental Verification of Electronic Equipment of a Satellite Borne Microwave Radiometer[J]. ENGINEERING SOLUTIONS FOR MANUFACTURING PROCESSES, PTS 1-3,2013,655-657:84-87. |
APA | Chen, Bo,&Chen, B .(2013).Thermal Design, Analysis and Experimental Verification of Electronic Equipment of a Satellite Borne Microwave Radiometer.ENGINEERING SOLUTIONS FOR MANUFACTURING PROCESSES, PTS 1-3,655-657,84-87. |
MLA | Chen, Bo,et al."Thermal Design, Analysis and Experimental Verification of Electronic Equipment of a Satellite Borne Microwave Radiometer".ENGINEERING SOLUTIONS FOR MANUFACTURING PROCESSES, PTS 1-3 655-657(2013):84-87. |
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