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Thermal analysis of a satellite Borne instrument
Chen, Bo; Li, Ning; 北京8701信箱
Source PublicationApplied Mechanics and Materials
AbstractThermal design and analysis of a satellite instrument is introduced in this paper. Some methods were adopted to help heat conduct and a finite element model was built. The analysis results showed that the temperature scopes of the main structures are from 45°C to 65.8°C and all of junction temperatures of the components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis. © (2014) Trans Tech Publications, Switzerland.
Conference Name2014 2nd International Conference on Mechatronics, Robotics and Automation, ICMRA 2014
Conference DateMarch 8, 2014 - March 9, 2014
Conference PlaceZhuhai, China
Indexed ByEI
Document Type会议论文
Corresponding Author北京8701信箱
Recommended Citation
GB/T 7714
Chen, Bo,Li, Ning,北京8701信箱. Thermal analysis of a satellite Borne instrument[C]. Switzerland:Trans Tech Publications,2014:1397-1400.
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