| Thermal analysis of a satellite Borne instrument | |
| Chen, Bo; Li, Ning; 北京8701信箱 | |
| Department | 微波遥感部 |
| Source Publication | Applied Mechanics and Materials |
| 2014 | |
| Pages | 1397-1400 |
| Language | 英语 |
| ISSN | 1660-9336 |
| ISBN | 9783038350781 |
| Abstract | Thermal design and analysis of a satellite instrument is introduced in this paper. Some methods were adopted to help heat conduct and a finite element model was built. The analysis results showed that the temperature scopes of the main structures are from 45°C to 65.8°C and all of junction temperatures of the components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis. © (2014) Trans Tech Publications, Switzerland. |
| Conference Name | 2014 2nd International Conference on Mechatronics, Robotics and Automation, ICMRA 2014 |
| Conference Date | March 8, 2014 - March 9, 2014 |
| Conference Place | Zhuhai, China |
| Indexed By | EI |
| Document Type | 会议论文 |
| Identifier | http://ir.nssc.ac.cn/handle/122/2774 |
| Collection | 微波遥感部 |
| Corresponding Author | 北京8701信箱 |
| Recommended Citation GB/T 7714 | Chen, Bo,Li, Ning,北京8701信箱. Thermal analysis of a satellite Borne instrument[C]. Switzerland:Trans Tech Publications,2014:1397-1400. |
| Files in This Item: | Download All | |||||
| File Name/Size | DocType | Version | Access | License | ||
| 20142AMM1397.pdf（381KB） | 会议论文 | 开放获取 | CC BY-NC-SA | View Download | ||
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