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Thermal Design of a Satellite Borne FPGA
Chen, Bo; Chen, B (reprint author), Chinese Acad Sci, Ctr Space Sci & Appl Res, Beijing 100190, Peoples R China.
Department微波遥感部
Source PublicationADVANCES IN MECHANICAL ENGINEERING, PTS 1-3
2011
Pages1411-1414
Language英语
ISSN1660-9336
ISBN978-3-03785-077-0
AbstractThermal design and analysis of a satellite borne FPGA is described in this paper. Thermal-conductive glue, vias and an aluminum bar were used to the FPGA and the PCB under the FPGA in order to help conduct the heat of the FPGA to heat sink. The results of finite element analysis showed that the case temperature T-c of the FPGA decreased from 132.5 degrees C to 55.4 degrees C and the junction temperature T-j decreased from 136.1 degrees C to59.0 degrees C after the thermal design, which matches the requirements of thermal design.; Thermal design and analysis of a satellite borne FPGA is described in this paper. Thermal-conductive glue, vias and an aluminum bar were used to the FPGA and the PCB under the FPGA in order to help conduct the heat of the FPGA to heat sink. The results of finite element analysis showed that the case temperature T-c of the FPGA decreased from 132.5 degrees C to 55.4 degrees C and the junction temperature T-j decreased from 136.1 degrees C to59.0 degrees C after the thermal design, which matches the requirements of thermal design.
KeywordThermal Simulation Thermal Analysis Finite Element Analysis Cae Derated Maximum Junction Temperature
Conference Name1st International Conference on Mechanical Engineering
Conference DateAPR 03-04, 2011
Conference PlacePhuket, THAILAND
Indexed ByEI ; CPCI
Document Type会议论文
Identifierhttp://ir.nssc.ac.cn/handle/122/3335
Collection微波遥感部
Corresponding AuthorChen, B (reprint author), Chinese Acad Sci, Ctr Space Sci & Appl Res, Beijing 100190, Peoples R China.
Recommended Citation
GB/T 7714
Chen, Bo,Chen, B . Thermal Design of a Satellite Borne FPGA[C]. STAFA-ZURICH:TRANS TECH PUBLICATIONS LTD,2011:1411-1414.
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