Thermal Design of a Satellite Borne FPGA | |
Chen, Bo; Chen, B (reprint author), Chinese Acad Sci, Ctr Space Sci & Appl Res, Beijing 100190, Peoples R China. | |
Department | 微波遥感部 |
Source Publication | ADVANCES IN MECHANICAL ENGINEERING, PTS 1-3 |
2011 | |
Pages | 1411-1414 |
Language | 英语 |
ISSN | 1660-9336 |
ISBN | 978-3-03785-077-0 |
Abstract | Thermal design and analysis of a satellite borne FPGA is described in this paper. Thermal-conductive glue, vias and an aluminum bar were used to the FPGA and the PCB under the FPGA in order to help conduct the heat of the FPGA to heat sink. The results of finite element analysis showed that the case temperature T-c of the FPGA decreased from 132.5 degrees C to 55.4 degrees C and the junction temperature T-j decreased from 136.1 degrees C to59.0 degrees C after the thermal design, which matches the requirements of thermal design.; Thermal design and analysis of a satellite borne FPGA is described in this paper. Thermal-conductive glue, vias and an aluminum bar were used to the FPGA and the PCB under the FPGA in order to help conduct the heat of the FPGA to heat sink. The results of finite element analysis showed that the case temperature T-c of the FPGA decreased from 132.5 degrees C to 55.4 degrees C and the junction temperature T-j decreased from 136.1 degrees C to59.0 degrees C after the thermal design, which matches the requirements of thermal design. |
Keyword | Thermal Simulation Thermal Analysis Finite Element Analysis Cae Derated Maximum Junction Temperature |
Conference Name | 1st International Conference on Mechanical Engineering |
Conference Date | APR 03-04, 2011 |
Conference Place | Phuket, THAILAND |
Indexed By | EI ; CPCI |
Document Type | 会议论文 |
Identifier | http://ir.nssc.ac.cn/handle/122/3335 |
Collection | 微波遥感部 |
Corresponding Author | Chen, B (reprint author), Chinese Acad Sci, Ctr Space Sci & Appl Res, Beijing 100190, Peoples R China. |
Recommended Citation GB/T 7714 | Chen, Bo,Chen, B . Thermal Design of a Satellite Borne FPGA[C]. STAFA-ZURICH:TRANS TECH PUBLICATIONS LTD,2011:1411-1414. |
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