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Thermal Design and Analysis of a Satellite Borne Electronic PCB
Chen, Bo; Chen, B (reprint author), Chinese Acad Sci, Ctr Space Sci & Appl Res, Beijing 100190, Peoples R China.
Department微波遥感部
Source PublicationADVANCES IN MECHANICAL DESIGN, PTS 1 AND 2
2011
Pages1551-1554
Language英语
ISSN1022-6680
ISBN978-3-03785-037-4
AbstractThermal design, finite element analysis of a satellite borne PCB is introduced in this paper. Some methods were adopted to help heat conduct and a simplified computing model was built. The analysis results show that the temperature scope of the main structure is from 45.5 degrees C to 72.3 degrees C in high temperature work case and all of junction temperatures of components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis.; Thermal design, finite element analysis of a satellite borne PCB is introduced in this paper. Some methods were adopted to help heat conduct and a simplified computing model was built. The analysis results show that the temperature scope of the main structure is from 45.5 degrees C to 72.3 degrees C in high temperature work case and all of junction temperatures of components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis.
KeywordThermal Simulation Thermal Analysis Finite Element Analysis Cae Derated Maximum Junction Temperature
Conference Name2nd International Conference on Manufacturing Science and Engineering
Conference DateAPR 09-11, 2011
Conference PlaceGuilin, PEOPLES R CHINA
Indexed ByEI ; CPCI
Document Type会议论文
Identifierhttp://ir.nssc.ac.cn/handle/122/3336
Collection微波遥感部
Corresponding AuthorChen, B (reprint author), Chinese Acad Sci, Ctr Space Sci & Appl Res, Beijing 100190, Peoples R China.
Recommended Citation
GB/T 7714
Chen, Bo,Chen, B . Thermal Design and Analysis of a Satellite Borne Electronic PCB[C]. STAFA-ZURICH:TRANS TECH PUBLICATIONS LTD,2011:1551-1554.
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