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Thermal Design, Analysis and Experimental Verification of a Satellite Borne Electronic Equipment
Chen, Bo; Chen, B (reprint author), Chinese Acad Sci, Ctr Space Sci & Appl Res, Beijing 100190, Peoples R China.
Department微波遥感部
Source PublicationADVANCED MANUFACTURING TECHNOLOGY, PTS 1, 2
2011
Pages611-614
Language英语
ISSN1022-6680
ISBN978-0-87849-205-3
AbstractThermal design, finite element analysis and experiment verification of a satellite borne power amplifier are introduced in this paper. Some methods were adopted to help heat conduct and a simplified computing model was built. The analysis results show that the temperature scope of the main structure is from 45.3 degrees C to 50.7 degrees C in high temperature work case and -9.7 degrees C to -4.3 degrees C in low temperature work case, and all of junction temperatures of components with high heat power consumption are lower than the derated maximum junction temperatures themselves and leave enough design margins. The experimental results show that the computing values are very close to experimental values and the largest error is 1.9 degrees C, which proved that the simplification of model and the values of computing parameters are reasonable. Thermal analysis with reasonable model simplification and computing parameters would be helpful for production design.; Thermal design, finite element analysis and experiment verification of a satellite borne power amplifier are introduced in this paper. Some methods were adopted to help heat conduct and a simplified computing model was built. The analysis results show that the temperature scope of the main structure is from 45.3 degrees C to 50.7 degrees C in high temperature work case and -9.7 degrees C to -4.3 degrees C in low temperature work case, and all of junction temperatures of components with high heat power consumption are lower than the derated maximum junction temperatures themselves and leave enough design margins. The experimental results show that the computing values are very close to experimental values and the largest error is 1.9 degrees C, which proved that the simplification of model and the values of computing parameters are reasonable. Thermal analysis with reasonable model simplification and computing parameters would be helpful for production design.
KeywordThermal Simulation Thermal Analysis Finite Element Analysis Cad Derated Maximum Junction Temperature
Conference NameInternational Conference on Advances in Materials and Manufacturing Processes
Conference DateNOV 06-08, 2010
Conference PlaceShenzhen, PEOPLES R CHINA
Indexed ByEI ; CPCI
Document Type会议论文
Identifierhttp://ir.nssc.ac.cn/handle/122/3337
Collection微波遥感部
Corresponding AuthorChen, B (reprint author), Chinese Acad Sci, Ctr Space Sci & Appl Res, Beijing 100190, Peoples R China.
Recommended Citation
GB/T 7714
Chen, Bo,Chen, B . Thermal Design, Analysis and Experimental Verification of a Satellite Borne Electronic Equipment[C]. STAFA-ZURICH:TRANS TECH PUBLICATIONS LTD,2011:611-614.
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