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Thermal analysis of a satellite instrument
Chen, Bo
Department微波遥感部
Source PublicationAIAA AVIATION 2014 -11th AIAA/ASME Joint Thermophysics and Heat Transfer Conference
2014
Language英语
ISBN9781624102813
AbstractThermal design and analysis of a satellite instrument is introduced in this paper. Some methods were adopted to help heat conduct and a finite element model was built. The analysis results showed that the temperature scopes of the main structures are from 45°C to 59.1 °C and all of junction temperatures of the components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis. The experimental results show that the computing values are close to experimental values and the largest error is 7.5 °C, which is allowed for engineering application.
Conference NameAIAA AVIATION 2014 -11th AIAA/ASME Joint Thermophysics and Heat Transfer Conference 2014
Conference DateJune 16, 2014 - June 20, 2014
Conference PlaceAtlanta, GA, United states
Indexed ByEI
Document Type会议论文
Identifierhttp://ir.nssc.ac.cn/handle/122/4341
Collection空间技术部
Recommended Citation
GB/T 7714
Chen, Bo. Thermal analysis of a satellite instrument[C]:American Institute of Aeronautics and Astronautics Inc.,2014.
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201432346.pdf(381KB) 开放获取CC BY-NC-SAApplication Full Text
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