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Thermal simulation of an electric box
Chen, Bo; Chen, Bo
Source PublicationApplied Mechanics and Materials
AbstractIn this paper thermal simulation of a satellite borne electric box is introduced. Structure was simplified and a finite element model was built. The analysis results showed that the temperature scopes of the box and the component cases are from 45 to 67.3 and all of junction temperatures of the components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis. © (2014) Trans Tech Publications, Switzerland.
Conference Name2014 International Conference on Manufacturing Technology and Electronics Applications, ICMTEA 2014
Conference DateNovember 8, 2014 - November 9, 2014
Conference PlaceTaiyuan, China
Indexed ByEI
Document Type会议论文
Corresponding AuthorChen, Bo; Chen, Bo
Recommended Citation
GB/T 7714
Chen, Bo,Chen, Bo. Thermal simulation of an electric box[C]:Trans Tech Publications Ltd,2014:597-600.
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