| Thermal simulation of an electric box | |
| Chen, Bo; Chen, Bo | |
| Department | 微波遥感部 |
| Source Publication | Applied Mechanics and Materials |
| 2014 | |
| Pages | 597-600 |
| Language | 英语 |
| ISSN | 1660-9336 |
| ISBN | 9783038353287 |
| Abstract | In this paper thermal simulation of a satellite borne electric box is introduced. Structure was simplified and a finite element model was built. The analysis results showed that the temperature scopes of the box and the component cases are from 45 to 67.3 and all of junction temperatures of the components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis. © (2014) Trans Tech Publications, Switzerland. |
| Conference Name | 2014 International Conference on Manufacturing Technology and Electronics Applications, ICMTEA 2014 |
| Conference Date | November 8, 2014 - November 9, 2014 |
| Conference Place | Taiyuan, China |
| Indexed By | EI |
| Document Type | 会议论文 |
| Identifier | http://ir.nssc.ac.cn/handle/122/5207 |
| Collection | 微波遥感部 |
| Corresponding Author | Chen, Bo; Chen, Bo |
| Recommended Citation GB/T 7714 | Chen, Bo,Chen, Bo. Thermal simulation of an electric box[C]:Trans Tech Publications Ltd,2014:597-600. |
| Files in This Item: | There are no files associated with this item. | |||||
Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.
Edit Comment