NSSC OpenIR  > 微波遥感部
Thermal simulation of an electric box
Chen, Bo; Chen, Bo
Department微波遥感部
Source PublicationApplied Mechanics and Materials
2014
Pages597-600
Language英语
ISSN1660-9336
ISBN9783038353287
AbstractIn this paper thermal simulation of a satellite borne electric box is introduced. Structure was simplified and a finite element model was built. The analysis results showed that the temperature scopes of the box and the component cases are from 45 to 67.3 and all of junction temperatures of the components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis. © (2014) Trans Tech Publications, Switzerland.
Conference Name2014 International Conference on Manufacturing Technology and Electronics Applications, ICMTEA 2014
Conference DateNovember 8, 2014 - November 9, 2014
Conference PlaceTaiyuan, China
Indexed ByEI
Document Type会议论文
Identifierhttp://ir.nssc.ac.cn/handle/122/5207
Collection微波遥感部
Corresponding AuthorChen, Bo; Chen, Bo
Recommended Citation
GB/T 7714
Chen, Bo,Chen, Bo. Thermal simulation of an electric box[C]:Trans Tech Publications Ltd,2014:597-600.
Files in This Item:
There are no files associated with this item.
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[Chen, Bo]'s Articles
[Chen, Bo]'s Articles
Baidu academic
Similar articles in Baidu academic
[Chen, Bo]'s Articles
[Chen, Bo]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[Chen, Bo]'s Articles
[Chen, Bo]'s Articles
Terms of Use
No data!
Social Bookmark/Share
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.