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一种电子元器件的散热装置及其制造方法
Application NumberCN201510017042.0
陈博; 李宁; 许可
2015-01-13
ClassificationH05K7/20(2006.01)I
Country中国
Abstract本发明提供了一种电子元器件的散热装置,所述装置包括:金属框架(3)、导热条(9)、若干个支撑小柱(10)和导热绝缘垫(14);在所述导热条(9)水平面板的边角处开设有若干个螺钉通孔(11);所述若干个螺钉(4)穿过螺钉通孔(11)和支撑小柱(10)内部的螺钉通孔,将导热条(9)、支撑小柱(10)和电路板(5)固定在一起;在所述的导热条(9)的两个侧边上开设若干个第一长圆螺钉通孔(12);所述金属框架(3)上与第一长圆螺钉通孔(12)对应位置开设有若干个第二长圆螺钉通孔(13),所述若干个螺钉(4)穿过第二长圆螺钉通孔(13)和第一长圆螺钉通孔(12),将导热条(9)和金属框架(3)固定在一起。
Language中文
Document Type专利
Identifierhttp://ir.nssc.ac.cn/handle/122/5212
Collection微波遥感部
Recommended Citation
GB/T 7714
陈博,李宁,许可. 一种电子元器件的散热装置及其制造方法[P]. 2015-01-13.
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