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Thermal analysis of a power box
Chen, B; Li, N.; Chen, B.
Department微波遥感部
Source PublicationManufacturing and Engineering Technology - Proceedings of the 2014 International Conference on Manufacturing and Engineering Technology, ICMET 2014
2015
Pages227-229
Language英语
ISBN9781138026452
AbstractThermal design and analysis of a satellite-borne power box is introduced in this paper. In order to control the temperature of the box, it is needed to arrange the heat transfer ways reasonably. Some methods were adopted and a finite element model was built. The results of the analysis showed that the temperature scopes of the box and the component cases are from 45°C to 67.6°C and all of the junction temperatures of the components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis. © 2015 Taylor and Francis Group, London.
Conference NameInternational Conference on Manufacturing and Engineering Technology, ICMET 2014
Conference DateOctober 17, 2014 - October 19, 2014
Conference PlaceSanya, China
Indexed ByEI ; CPCI
Document Type会议论文
Identifierhttp://ir.nssc.ac.cn/handle/122/5284
Collection微波遥感部
Corresponding AuthorChen, B.
Recommended Citation
GB/T 7714
Chen, B,Li, N.,Chen, B.. Thermal analysis of a power box[C]:CRC Press/Balkema,2015:227-229.
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